• Excellent Thermal Pad for Heat Dissipation: the thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down, improve the heat transfer between the CPU /GPU/SSD/IC/LED/ chipset / motherboard / module and the heat sink.
• Smalloo Thermal Pad has a larger size and high thermal conductivity: 100×100×2mm, cut freely according to your needs. Upgraded thermal silica gel material with 8 W/mK thermal conductivity.
• The Silicone Thermal Pads has better performance: In -58 ℃ -200 ℃ range does not melt, good Stability, no Toxic, odorless, no corrosion, no stimulation, no damage to metal materials. Easy To Install, replaces traditional heatsink compound grease paste.
• Widely applications: The Thermal Pad is Perfectly traditional for heatsink, great for Control board, motor, electronics, CPU, GPU, Heat Sink, Power LED, auto mechanics, computer host, laptop, DVD, VCD, LID, Set-top box, LED IC SMD DIP and any cooling modules.
• We have 8 different sizes for you to choose: 100×100×0.5mm, 100×100×1mm, 100×100×1.5mm, 100×100×2mm, 100×100×2.5mm, 100×100×3mm, 100×100×3.5mm, 100×100×4mm.

Package included:

Color: grey

Parameters:

Thermal Conductivity: 8w/m-K.

Material: conduction silicone.

Continuous Temperature: -58℃~200℃.

Breakdown Voltage: 5kv/mm.

Density:3.26(g/cc)

Hardness:68

Tensile Strength:15(psi)

Dielectric constant:15(1M Hz)

Volume resistance:6.0×10^13

Fire-proof level：94 V0

Thickness: 2mm.

Why use thermal silicone Pad ?

1) The main purpose of the choice of Thermal Pad is to reduce the heat source surface and the heat dissipation device contact surface

between the contact thermal resistance, Thermal conductivity of silicone Pad can be good filling the gap between the contact surface;

2) because the air is hot bad conductor, will seriously hinder the heat transfer between the contact surface,

And in the heat source and the radiator between the installation of thermal silica Pad can be out of the air contact surface;

3) with thermal silicone Pad supplement, you can make the heat source and the heat sink between the contact surface better

full contact,Truly face to face contact in the temperature of the reaction can be achieved as small as possible temperature difference.